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Can we change PCB stack up for Watchman Core Module and EVM Application Board ?


SaiTejaManchukanti

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We are building custom Steam VR tracking HDK kit from reference designs. According to fab docs, top and bottom layers of Watchman Core Module and EVM Application Board should be ¼ oz cu thickness, but in Altium CAD layer stack manager details it is given as 0.04445mm (1+1/4oz) thickness. ( * When i open design files in altium). 
Which layer stack up details are need to be followed? 

Our manufacturer can provide with minimum of 1 oz cu thickness for outer layers . Can we go with it?

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